Fomuw ni sɛbɛnw .

Plasma surface furakɛli min bɛ kɛ ka ɲɛsin fomuw & sɛbɛnw ma .

Unlike thin films, ​foam substrates and rigid sheets​ pose unique challenges due to their thickness (>5mm) ani morphologie complexe (cavités, fiɲɛ dontaw). An ka injiniyɛriw bɛ ninnu ɲɛnabɔ ni:

Elektɔriw minnu bɛ se ka ladilan: Discharge gaps customizables (fo ka se 50mm ma) bɛ a to plasma flux kelen bɛ sɔrɔ yɔrɔ finmanw kɔnɔ.

A bɛ fiɲɛ bila fiɲɛ na: a bɛ don kɔnɔna na k’a sɔrɔ a ma tiɲɛni kɛ funteni na, o bɛ fiɲɛ minɛlen bɔ min bɛ nɔrɔli tiɲɛ.

Fɛnw-Labɛn kɛrɛnkɛrɛnnenw: fanga ɲuman (misali la, 10W polimɛriw kama, 700W nɛgɛw kama) ani gazi ɲagaminenw (n2/o2/he) bɛ substrat tiɲɛni bali.

Mun na nin nafa ka bon i ka ɲinini na:

Porose fomuw: Plasma bɛ kɔnɔna kogow baara, ka se ka a juguya-coating adhesion in PU/PI foams minnu bɛ kɛ mobili sigilanw ni furakɛli fɛnw na.

​Laminated Sheets: Increases peel strength by >40% ye aluminiyɔmu-polimɛriw ye minnu bɛ ɲɔgɔn sɔrɔ surface activation fɛ ka kɔn bonding ɲɛ.

Surfaces contourées : non-Plasma jets treat 3D cogoyaw (misali la, die-cast auto parts) ni saraka masike tɛ.

Engineering (Engineering) furakɛcogo dɔw ye:

▶︎ Cavité-Plasma kunkolo ɲumanw ka ɲɛsin dasiri ma-Cell foam .

▶︎ HV bɔli kɔlɔsili walasa ka arcing bali fiɲɛbɔlanw kɔnɔ .

▶︎ Tiɲɛ-Waati impedansi kɔlɔsili ka ɲɛsin fɛnw falenni ma .