Elektroniki sɛbɛnnenw .
Precision plasma surface treatment ka ɲɛsin electronics sɛbɛnnenw ma & flexible minɛnw ma .
Plasma surface furakɛli ɲɛtaa bɛ se ka kɛ sababu ye ka adhesion enhancement reliable sɔrɔ substrats sensitifs kan minnu bɛ kɛ:
- Circuits imprimés flexibles (FPCS)- Polyimide activate (PI) ani PET filimuw ka ɲɛsin tintiri bonding conductive ma .
- OLED/LCD jiralanw - pre-Lamini furakɛli ultra-finimugu gilasi (UTFG) ani ITO dacogo
- finman-Sifilenw batiriw - Li{2}}ion electrode foils surface baarakɛcogo .
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Gɛlɛya |
Plasma solution . |
Nafa sɔrɔli fɛɛrɛko la . |
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Polimɛriw minnu fanga ka dɔgɔ, olu . |
Oksizɛni/Argon/Plasma bɛ hidroksili ({0}}OH) & karɔkisi ({1}}COOH) don . |
Contact angle dɔgɔyali ka bɔ degere 80 →30 degɛrɛ la .<1s |
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Discharge-Fɛn minnu bɛ se ka kɛ fɛn ye . |
Pulsed DBD plasma ka .<50°C prevents thermal damage |
nanoscale modification ( .<10nm depth) only |
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Adhesion dɛsɛ UTFG kan . |
DCSBD plasma bɛ hidrɔkarbɔnw bɔ ka sɔrɔ ka oksizɛni baarakɛcogo fara a kan . |
1019000000000009999 . |
Material-Baarakɛcogo kɛrɛnkɛrɛnnenw .
- Polimidi filimuw (kapton®) .
Taabolo: N3/H3 Plasma à 20KHz, 7KV
O kɔlɔlɔ: 60% ka caya ink adhesion ni corona furakɛli .
- ultra-Glass thin (UTFG) .
Taabolo: Koplanar surface barika bɔli (DCSBD) jɛnsɛnnen .
Résultat: 40% Conductivité PEDOT:PSS Coatings .
- LI-Ion Electrode Foils
Taabolo: Plasma atmosphère ni HE/O3
O kɔlɔlɔ: 15% ka caya ka tɛmɛ ɲɛgɛnɛsira laminiw na .
- Engineer-Furakɛcogo labɛnnenw bɔli kama-Fɛn minnu bɛ se ka kɛ fɛn ye .
An ka sitɛmuw bɛ ɲɔgɔn don tiɲɛ na-Waati impedansi kɔlɔsili ani adaptive power control walasa ka arcing bali:
Funteni-Bio-Polimɛriw (misali la, PLGA scaffolds)
Micro-ITO yɔrɔw labɛncogo .
Batiriw ka ɲɔgɔn danfaralanw .
- Aw ye kuma an ka surface engineering jɛkulu fɛ nin kama:
▶︎ Matériel Compatibilité Testing Report (A bɛ sɔrɔ WCA/SEM/XPS ka kunnafoniw kɔnɔ)
▶︎ Baarakɛcogo tiɲɛni ni i ka substrats (PI/COP/PEN) ye .
▶︎ On-Yɔrɔ paramɛtiriw ɲɛnabɔli walasa ka bɔli tiɲɛni bali .